汽车工业
数码产品
供应链
材料科学
湿度
电子元件
环境科学
产品(数学)
相(物质)
热导率
阿累尼乌斯方程
电子包装
电子产品
环境影响评价
业务
半导体工业
纳米技术
新产品开发
法律工程学
工艺工程
半导体
非晶半导体
作者
Yunli Zhang,Pradeep Lall,Daniel K. Harris
标识
DOI:10.1109/itherm55376.2025.11235792
摘要
The widespread use of PFAS in electronic packaging poses environmental and health risks due to their persistence. Detectable PFAS in water and food, along with health effects, highlight the need for alternatives. While PFAS are crucial in electronics, their impact extends beyond product life cycles. Regulations may phase them out, challenging the industry to find non-PFAS solutions. The interconnected supply chain amplifies this impact. Developing alternatives is vital for reducing e-waste and protecting future generations, making research into nonPFAS materials essential for sustainable electronics.This paper outlines a methodology for assessing the impact of hydrothermal aging on non-PFAS semiconductor electronic packaging materials. The primary focus of this study involves the examination of thermal conductivity for TIMs in its initial state (pristine samples). Additionally, the research delves into the consequences of prolonged exposure to elevated temperatures and humidity on various thermal interfacial materials (TIMs), exploring the aging process. The Arrhenius Equation is also applied to evaluate the aging effect and the temperature effect on activation energy. Activation energy and the evolution of time exponents are reported. While the detrimental effects of PFAS are well-documented, the existing research landscape lacks comprehensive exploration and viable alternatives in electronic packaging. The dearth of non-PFAS solutions in electronic design and fabrication poses a critical gap, especially considering the impending regulatory measures aimed at eliminating PFAS from consumer products. This deficiency is exacerbated by the interconnected nature of the electronics supply chain, where any regulatory action would reverberate across all levels, from individual components to complete electronic systems. This research investigates the mechanical and thermal properties evolution of a number of non-PFAs TIMs when subjected to longterm, high-temperature and humidity exposure. The study explores the thermal conductivity evolution of TIMs in high temperature and humidity environments ($85 \mathrm{C} 85 \% \mathrm{RH}$) and (60 C $60 \% \mathrm{RH})$ for 164 hours. The results will compare with the existing data of non-PFAs, UFs and TIMs.
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