A novel composite bionic leaf vein and honeycomb microchannel heat sink applied for thermal management of electronic components

Based on the bionic concept and fractal theory, a composite bionic microchannel radiator based on veins and honeycombs is designed in this work to address the problem of heat dissipation in electronic components. The convective heat transfer within the novel microchannel structure is numerically investigated, and the effects of the coolant (Fe3O4-water nanofluids) and the surface bump structure on the overall performance of the microchannel are explored. Compared to the traditional ordinary leaf vein-shaped fractal microchannels, the proposed microchannel heat sink in this work demonstrated a significant heat dissipation effect, with an optimal increase in the Nusselt number of 64.5%. The best microchannel heat dissipation was achieved using Fe3O4-water nanofluids with a mass fraction of 0.5%. Additionally, changing the height and arrangement of the bump structure allows for improving heat transfer by a maximum of 8% compared to microchannels without the bump structure. Furthermore, the novel bionic microchannel heat sinks are evaluated, and the resulting optimized microchannel structure has a comprehensive performance index of 1.11. Overall, the study results provide useful information and serve as a reference for designing new bionic heat sinks for the thermal management of electronic components.