Enhanced imaging of Subsurface Damage in optical glass SF6 with Optical Coherence Tomography using KOH wet etching

Mechanical cracks induced during grinding of brittle materials known as subsurface damage (SSD) reduce mechanical and optical properties of optical components. A characterisation of SSD is needed to guarantee a good quality and to optimize individual processes and processing chains. Current research focuses on non-destructive methods such as optical coherence tomography (OCT) to evaluate SSD depth and distribution and to replace currently established, but time-consuming and labour-intensive destructive methods. Yet the imaging of SSD remains challenging, even with high-resolution OCT providing a high sensitivity. The presented work proposes a combined measurement approach of enhanced SSD imaging by using a potassium hydroxide (KOH) wet etching process prior to OCT measurement. An etching process using 30% KOH at 80°C is applied and resulting etching rates are analysed. It is shown by an iterative etching experiment on optical glass SF6 that the KOH etching process enhances OCT signals of SSD under the surface, revealing up to 2.4-times deeper maximum SSD depths using an identical measurement setup.