捆绑                        
                
                                
                        
                            热传导                        
                
                                
                        
                            巴(单位)                        
                
                                
                        
                            材料科学                        
                
                                
                        
                            机械                        
                
                                
                        
                            热力学                        
                
                                
                        
                            物理                        
                
                                
                        
                            复合材料                        
                
                                
                        
                            气象学                        
                
                        
                    
            作者
            
                R. Wyczó lkowski,Michele La,J. Boryca            
         
                    
        
    
            
            标识
            
                                    DOI:10.12693/aphyspola.136.1001
                                    
                                
                                 
         
        
                
            摘要
            
            This paper presents a computational model used for quantitative analysis of heat conduction process in a flat bed of steel round bars.For this purpose, an approach based on using the analogical mathematical description of the electricity and heat flow phenomena was applied.Furthermore, this model is semi-empirical since it uses dependencies determined based on experimental research.The basis for deriving the mathematical dependencies is the geometric model of the system studied, defined by the so-called elementary cell.Each of the mechanisms of heat conduction that occurs within the cell was assigned an appropriate thermal resistance.The total thermal resistance of a cell is a combination of parallel and serial connections of individual resistances.The calculations were made for the temperature range of 0-800 • C, for four bar diameters and two porosities.
         
            
 
                 
                
                    
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