半导体
扫描电子显微镜
电子显微镜
材料科学
电子
纳米
常规透射电子显微镜
电子束诱导沉积
半导体器件
光电子学
显微镜
分辨率(逻辑)
显微镜
光学
纳米技术
扫描透射电子显微镜
计算机科学
物理
人工智能
复合材料
图层(电子)
量子力学
标识
DOI:10.1088/1361-6501/abd96d
摘要
Abstract Currently, semiconductor devices are manufactured in a technology node of several nanometers. Electron microscopy is mainly used in semiconductor inspection in manufacturing stages since accelerated electrons have wavelengths of nanometers or less, and a high spatial resolution can be expected. Among various electron microscopes since the scanning electron microscope (SEM) can observe the sample as it is without processing the sample, the SEM-based inspection instrument is mainly used at each stage of manufacturing the semiconductor device. The paper presents a review of SEM-based electron microscopy in semiconductor inspection. First, an overview of electron microscopy is described to understand the electron-sample interaction, the characteristics of electrons emitted from an irradiated specimen, charging, noise, and so on. Next, application areas such as mask inspection are introduced. Finally, future challenges are discussed.
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