Comparison of hybrid polyimide films with silica and organosilica obtained via sol–gel process

A series of polyimide/silica (PI–S) and polyimide/organosilica (PI–OS) hybrid films were prepared via a sol–gel process from mixtures of poly(amic acid) (PAA) and tetraethoxysilane or a silane coupling agent in solution. The PAA was synthesized from bis-(3-phthalyl anhydride) ether and 1,4-bis (4-aminophenoxy) benzene. The hybrid films were produced via an imidization reaction to form silica particles or a silica network in a polymer matrix through a programmed heating process. The derived films were characterized and compared by Fourier transform infrared spectroscopy, field emission scanning electron microscopy, thermogravimetric analysis, tensile testing, contact angle measurements, moisture absorption measurements, and dielectric property analysis. Both the PI–S and PI–OS hybrid matrixes showed strong regularity with the increasing silica content and greatly improved thermal stability and mechanical properties. Among them, the PI–OS hybrid films possessed superior interphase interactions and were found to have better physicochemical properties.