电子设备和系统的热管理
纳米技术
材料科学
数码产品
热的
桥接(联网)
领域(数学)
石墨烯
热工
计算机科学
热导率
系统工程
机制(生物学)
出处
期刊:
[Elsevier BV]
日期:2026-09-01
卷期号:2 (9): 100298-100298
标识
DOI:10.1016/j.revmat.2026.100298
摘要
The burgeoning progress of artificial intelligence (AI) has profoundly escalated the demand for high-performance computing, further compounding the thermal management challenges inherent in device operation. Consequently, advanced thermal management has emerged as a factor no less critical than computational speed. Graphene, distinguished by its exceptional intrinsic thermal conductivity, has attracted extensive research interest in the field of thermal management over the past decade. Recent studies have increasingly explored the integration of graphene-based thermal management materials into practical electronic systems. They are now recognized as promising candidates for the robust operation of high-power electronic devices and contribute to the development of system-level thermal management frameworks. This review examines the intrinsic thermal properties of graphene and its composites, with emphasis on the microscopic mechanisms of heat transport in two-dimensional crystals, and systematically summarizes recent advances in their application to electronic device thermal management. By bridging theoretical mechanisms and engineering perspectives, this review aims to provide a systematic reference for the rational design and application-specific selection of graphene-based thermal management materials.
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