材料科学
铜
合金
引线框架
电导率
冶金
色散(光学)
铜合金
复合材料
半导体器件
物理
物理化学
光学
图层(电子)
化学
作者
Zeng De Li,Lin Chen,Cui Shun
出处
期刊:Advanced Materials Research
日期:2014-10-01
卷期号:1053: 61-68
被引量:24
标识
DOI:10.4028/www.scientific.net/amr.1053.61
摘要
High-strength and high-conductivity copper alloy is a kind of structural function materials, which has excellent comprehensive mechanical and physical properties. The strengthening methods of copper alloy are summarized. The basic requirements of high-strength and high-conductivity copper alloy is established. The application of the materials is described, including lead frame materials, electrified contact wires materials, electrode Materials. Meanwhile, the alumina dispersion strengthened copper alloy is introduced. The internal oxidation process, structure, dispersoid and anti-intenerate properties have also been analysis in detail. Finally, the development direction of this material is put forward.
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