Microelectronic Packaging: Electrical Interconnections

The importance and development of wirebonding technology in the first-level microelectronic packaging have been the focus of this review article. This article begins with the discussion of other existing first level packaging methods in comparison with wirebonding technique. The formation and reliability of wirebonding interconnects through various methods have been described. Materials required for wirebonding are discussed in relation to bonding wire, pad metallization, and pad cleaning. Advanced interconnection techniques and future development in the field of wirebonding technology have also been described.