Process optimization and characterization of dielectric, piezoelectric, and ferroelectric properties of 30% ScAlN thin films

Scandium-doped aluminum nitride (ScAlN) is a promising replacement for undoped aluminum nitride in MEMS vibration and acoustic sensors due to its higher piezoelectric coefficients, and for RF MEMS due to its enhanced piezoelectric response and ferroelectric switching capability. However, poor process conditions often lead to degraded film performance. In this work, we optimized the growth conditions of ScAlN thin films deposited by reactive pulsed-DC magnetron sputtering system by studying the impact of N₂ flow rate, target–substrate distance, substrate temperature, and substrate bias on film stress, crystallinity, and surface morphology. Based on stress measurements, XRD rocking curves along the c-axis (002), and roughness with AOG formation probability extracted from AFM and SEM images, an optimized deposition recipe was developed that balances stress, crystallinity, and AOG density. With this optimized recipe, samples were fabricated for dielectric, ferroelectric, and piezoelectric coefficient (d33,f and d31,f) measurements. To verify scalability, d33,f, εr, and tan(δ) were measured on 100, 150, and 200 mm substrates. Dual beam laser interferometry results showed d33,f values of around 18 pm/V, εr of 18, and lowest tan(δ) of 0.4%. Cantilever-based d31,f measurements yielded a value of −6.22 pC/N. The optimized ScAlN films also exhibited remnant polarization, Pr = 130 μC/cm², and coercive field, Ec = 3.5 MV/cm.