Lignin‐Based Encapsulation of Liquid Metal Particles for Flexible and High‐Efficiently Recyclable Electronics

Abstract Room‐temperature liquid metals (RTLMs) have excellent shape reconfiguration capabilities, which make them ideal for flexible electrodes, sensors, and energy devices. However, due to the high surface tension and weak adhesion of RTLM, the types of printing substrates, patterning, and recovery processes are limited. It is essential to develop advanced encapsulation techniques for the patterning of RTLMs. Lignin has great potential for promotion as nanodispersants and nanocarriers because of its abundant hydroxyl groups and good self‐assembly properties. In this work, a green and facile encapsulation method using industrial lignin is reported for stable, uniform, and reproducible patterning of eutectic gallium–indium (EGaIn). Lignin‐encapsulated EGaIn particles exhibit good stability and can be patterned on the surface of various substrates with a simple ballpoint pen. The electrical resistance of the conductive tracks shows little change under bending and twisting (720°) conditions. More importantly, the lignin‐encapsulated system can be easily dissolved and regenerated, which is also supported by molecular dynamics simulations and density functional theory calculations. 96.9% of the EGaIn can be recovered from the system. These characteristics make it very environmentally friendly throughout the preparation process and find applications in flexible sensors, transient circuits, and many other areas.