Ultra‐Flyweight Cryogels of MXene/Graphene Oxide for Electromagnetic Interference Shielding

材料科学 电磁干扰 电磁屏蔽 电磁干扰 石墨烯 氧化物 复合材料 导电体 多孔性 纳米技术 电子工程 冶金 工程类
作者
Ahmadreza Ghaffarkhah,Seyyed Alireza Hashemi,Sara Rostami,Majed Amini,Farhad Ahmadijokani,Ali Pournaghshband Isfahani,Sameer E. Mhatre,Orlando J Rojas,Milad Kamkar,Stefan Wuttke,Masoud Soroush,Mohammad Arjmand,Ahmadreza Ghaffarkhah,Seyyed Alireza Hashemi,Sara Rostami,Majed Amini,Farhad Ahmadijokani,Ali Pournaghshband Isfahani,Sameer E. Mhatre,Orlando J Rojas
出处
期刊:Advanced Functional Materials [Wiley]
卷期号:33 (50) 被引量:67
标识
DOI:10.1002/adfm.202304748
摘要

Abstract MXene and graphene cryogels have demonstrated excellent electromagnetic interference (EMI) shielding effectiveness due to their exceptional electrical conductivity, low density, and ability to dissipate electromagnetic waves through numerous internal interfaces. However, their synthesis demands costly reduction techniques and/or pre‐processing methods such as freeze‐casting to achieve high EMI shielding and mechanical performance. Furthermore, limited research has been conducted on optimizing the cryogel microstructures and porosity to enhance EMI shielding effectiveness while reducing materials consumption. Herein, a novel approach to produce ultra‐lightweight cryogels composed of Ti 3 C 2 T x /graphene oxide (GO) displaying multiscale porosity is presented to enable high‐performance EMI shielding. This method uses controllable templating through the interfacial assembly of filamentous‐structured liquids that are readily converted into EMI cryogels. The obtained ultra‐flyweight cryogels (3–7 mg cm −3 ) exhibit outstanding specific EMI shielding effectiveness (33 000–50 000 dB cm 2 g −1 ) while eliminating the need for chemical or thermal reduction. Furthermore, exceptional shielding is achieved when the Ti 3 C 2 T x /GO cryogels are used as the backbone of conductive epoxy nanocomposites, yielding EMI shielding effectiveness of 31.7–51.4 dB at a low filler loading (0.3–0.7 wt%). Overall, a one‐of‐a‐kind EMI shielding system is introduced that is readily processed while affording scalability and performance.
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