平坦度(宇宙学)
放大器
材料科学
线性
宽带
功率增加效率
电气工程
驻波比
射频功率放大器
高电子迁移率晶体管
功率增益
电子工程
光电子学
工程类
物理
电信
电压
晶体管
微带天线
CMOS芯片
宇宙学
量子力学
天线(收音机)
作者
Shengqi Li,Guodong Su,Xiang Wang,Han Liu,Jun Liu
标识
DOI:10.1016/j.mejo.2023.105887
摘要
This paper presents a 4.5–8.5 GHz three-stage power amplifier(PA) fabricated in a 0.5 μm GaAs process. The PA adopts gain compensation technology with gain flatness and power transmission in the broadband. Furthermore, the size of the pHEMT is optimized to strike a balance among linearity, power-added efficiency (PAE) and the area. The measurement results show that the proposed PA has a gain flatness of 22.6 ± 0.8 dB with good input and output VSWR, the output saturation power is of 25 dBm and the corresponding power added efficiency is greater than 32% over the whole operating frequency band. This proposed PA has better broadband gain flatness and power characteristics compared to the conventional cascaded PA. The chip size of the PA is 2.475 mm × 0.9 mm, including all DC and RF pads.
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