接触角
磁滞
材料科学
表面粗糙度
表面光洁度
下降(电信)
单层
复合材料
薄脆饼
纳米技术
凝聚态物理
物理
计算机科学
电信
作者
Kuan‐Yu Yeh,Li‐Jen Chen,J. S. Chang
出处
期刊:Langmuir
[American Chemical Society]
日期:2007-12-08
卷期号:24 (1): 245-251
被引量:217
摘要
A series of pillar-like patterned silicon wafers with different pillar sizes and spacing are fabricated by photolithography and further modified by a self-assembled fluorosilanated monolayer. The dynamic contact angles of water on these surfaces are carefully measured and found to be consistent with the theoretical predictions of the Cassie model and the Wenzel model. When a water drop is at the Wenzel state, its contact angle hysteresis increases along with an increase in the surface roughness. While the surface roughness is further raised beyond its transition roughness (from the Wenzel state to the Cassie state), the contact angle hysteresis (or receding contact angle) discontinuously drops (or jumps) to a lower (or higher) value. When a water drop is at the Cassie state, its contact angle hysteresis strongly depends on the solid fraction and has nothing to do with the surface roughness. Even for a superhydrophobic surface, the contact angle hysteresis may still exhibit a value as high as 41 degrees for the solid fraction of 0.563.
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