Glass-on-Silicon Interposer with High Heat Dissipation Capacity and Excellent RF Compatibility

As the growing demand for high power and high-density RF device integration, the system faces a serious thermal challenge. Microfluidic cooling has emerged as an effective method for heat dissipation inside electronic devices. In this paper,a design of Glass-on-Silicon interposer with high heat dissipation capacity and excellent RF compatibility was developed. With the manifold micro-channel, large amount of heat can be dissipated directly into the coolant. With the design of a glass layer bonded to the Si substrate, high-frequency device was compatible to the interposer. Low flow resistance was achieved by a special design of double-layer and extremely short micro-channels. The heat dissipation performance of the manifold structure with different channel widths and channel heights was explored by numerical simulation. RF characteristic of the Glass-on-Si interposer was verified by investigating the electrical performance of a coplanar waveguide line (CPW line). The transmission loss was only 20% of the same case for Si interposer.