材料科学
石墨烯
复合材料
硅橡胶
硅酮
氧化物
纳米复合材料
复合数
散热膏
热导率
有机硅树脂
硫化
天然橡胶
涂层
纳米技术
冶金
作者
Weijie Liang,Xin Ge,Jianfang Ge,Tiehu Li,Tingkai Zhao,Xunjun Chen,Song Yao-zhen,Yaodong Cui,Muhammad Saleem Khan,Jianye Ji,Xiaoyan Pang,Ruoling Liu
出处
期刊:Polymers
[Multidisciplinary Digital Publishing Institute]
日期:2018-11-12
卷期号:10 (11): 1254-1254
被引量:35
标识
DOI:10.3390/polym10111254
摘要
With developments of the electronics industry, more components are being included in electronic devices, which has led to challenges in thermal management. Using reduced graphene oxide embedded with MQ silicone resin (RGO/MQ) nano-aggregates as the composite filler and silicone rubber (SR) as the matrix, a simple approach is designed to prepare RGO/MQ/SR composites. Reduced graphene oxide (RGO) was first used as a substrate for the growth of MQ silicone resin by hybridization, forming sandwich-like micro structured RGO/MQ nano-aggregates successfully. Then, RGO/MQ was integrated into α,ω-dihydroxylpolydimethylsiloxane based on the in situ solvent-free blending method, followed by condensation and vulcanization, fabricating the final RGO/MQ/SR composites. The effective strategy could enhance the adaptability between graphene and silicone matrix under external stimuli at room temperature by embedding nanoscale MQ into the interface of graphene/silicone as the buffer layer. Obvious improvements were found in both thermal conductivity and mechanical properties due to excellent dispersion and interfacial compatibility of RGO/MQ in the host materials. These attractive results suggest that this RGO/MQ/SR composite has potential as a thermal interface material for heat dissipation applications.
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