材料科学
铜
涂层
化学镀
表征(材料科学)
镀铜
冶金
电镀(地质)
镀金(软件工程)
纳米技术
电镀
计算机科学
图层(电子)
地球物理学
软件工程
地质学
作者
Mehmet Uysal,Tuğrul Çetіnkaya,Harun Gül,Muhammet Kartal,Hasan Algül,Mahmud Tokur,Ahmet Alp,Hatem Akbulut
标识
DOI:10.12693/aphyspola.127.1106
摘要
In this work, Sn-Cu composite powders were produced using an electroless process.The tin content on the surface of copper powders was varied by using dierent concentrations of SnSO4 in the plating bath.The surface morphology of the produced Sn-Cu composite powders was characterized using scanning electron microscopy (SEM).Energy dispersive spectroscopy (EDS) was used to determine the elemental surface composition of the composites.X-ray diraction (XRD) analysis was performed to investigate the structure of the Sn-Cu composite powders.The electrochemical performance of Sn-Cu nanocomposites was studied by charge/discharge tests.
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