Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications
作者
Kaya Demir,Vijay Sukumaran,Yoichiro Sato,Abderrahim El Amrani,Koushik Ramachandran,Raghuram V. Pucha,Pulugurtha Markondeya Raj,Venkatesh Sundaram,Rao Tummala