材料科学
碳化硅
电流(流体)
光电子学
电气工程
频道(广播)
炸薯条
图层(电子)
工程物理
功率(物理)
电子工程
纳米技术
复合材料
工程类
量子力学
物理
作者
Maxime Berthou,Philippe Godignon,Pierre Brosselard,Dominique Tournier,José del R. Millán
出处
期刊:Materials Science Forum
日期:2012-05-14
卷期号:717-720: 1093-1096
被引量:3
标识
DOI:10.4028/www.scientific.net/msf.717-720.1093
摘要
Silicon Carbide VDMOS with integrated current and temperature sensors have been successfully fabricated without degradation of the chip forward or reverse characteristics due to the sensors. The temperature sensors show impedance correlated to the temperature, which permits to track the drift region’s temperature of the device. We have shown that the sensor current ratio can be influenced by the current spreading in the drift layer, especially when the channel resistance contribution is reduced. This aspect will be more critical on VDMOS with low channel resistance. Also, the sensor current ratio stability will be improved on devices with larger active area or thinner drift layer. Integration of such sensors will permit to monitor and protect innovative power electronic systems using SiC chips.
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