双金属
材料科学
微观结构
铜
摩擦学
冶金
枝晶(数学)
图层(电子)
复合数
复合材料
数学
几何学
作者
Yuanyuan Kang,Guowei Zhang,Zhaojie Wang,Hong Xu,An Wan
出处
期刊:Materials
[MDPI AG]
日期:2022-01-10
卷期号:15 (2): 492-492
被引量:7
摘要
In this paper, the solid–liquid composite method is used to prepare the steel–copper bimetal sample through two-stage cooling process (forced air cooling and oil cooling). The relationship between the different microstructures and friction properties of the bimetal copper layer is clarified. The results show that: the friction and wear parameters are 250 N, the speed is 1500 r/min (3.86 m/s), the friction coefficient fluctuates in the range of 0.06–0.1, and the lowest point is 0.06 at 700 °C. The microstructure of the copper layer was α-Cu, δ, Cu3P, and Pb phases, and Pb was free between α-Cu dendrites. When the solidification temperature is 900 °C, the secondary dendrite of α-Cu develops. With the decrease temperature, the growth of primary and secondary dendrites gradually tends to balance at 700 °C. During the wear process, Pb forms a self-lubricating film uniformly distributed on the surface of α-Cu, and the Cu3P and δ phases are distributed in the wear mark to increase α-Cu wear resistance.
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