模具(集成电路)
倒装芯片
材料科学
晶片切割
引线键合
柔性电子器件
晶片键合
CMOS芯片
薄脆饼
光电子学
炸薯条
电子工程
电气工程
纳米技术
工程类
图层(电子)
胶粘剂
作者
Muhammad Hassan Malik,Andreas Tsiamis,Hubert Zangl,Alfred Binder,Srinjoy Mitra,Ali Roshanghias
出处
期刊:Electronics
[Multidisciplinary Digital Publishing Institute]
日期:2022-03-08
卷期号:11 (6): 849-849
被引量:10
标识
DOI:10.3390/electronics11060849
摘要
Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an electrochemical impedance sensor, and Complementary Metal Oxide Semiconductor (CMOS) die. Both are drawn from an MPW batch, thinned at die-level after dicing and singulation down to 60 µm. The thinned dies were flip-chip bonded to flexible substrates and hermetically sealed by two techniques: thermosonic bonding of Au stud bumps and anisotropic conductive paste (ACP) bonding. The performance of the thinned dies was assessed via functional tests and compared to the original dies. Furthermore, the long-term reliability of the flip-chip bonded thinned sensors was demonstrated to be higher than the conventional wire-bonded sensors.
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