Small and scalable laser source for AR glasses by hybrid integration of silicon nitride PIC technology

A laser engine is demonstrated based on a silicon-nitride PIC. It uses a flip-chip assembly process for hybrid integration of the red, green and blue laser diodes, into etched recesses in the silicon nitride PIC and is based on passive alignment, meaning the laser is not tuned on during assembly. The TriPleX^® waveguide technology optimizes the ellipticity of the modes at the laser side from 1:3 to circular (1:1) at the output side. Output powers of >1mW are measured and depend on the laser diodes used. The described assembly approach facilitates wafer level laser diode integration and wafer level hermetic packaging for scalable volume manufacturing.