High-power laser material processing utilizing high-speed combined motion of scanner and linear axes system

An innovative approach to enhance high-power laser material processing through the integration of a high-speed motion system combining galvo scanner and linear axes is presented. The research focuses on its application in Printed Circuit Board (PCB) depaneling with lasers, showcasing its precision and efficiency. The combined motion system, featuring a galvo laser beam scanner and multi-axis linear actuator structure, is custom designed to meet the specific demands of PCB depaneling. By combining the strengths of both components, complicated cutting patterns are achieved while minimizing thermal and mechanical stresses on the workpiece. Key to the system's success is the seamless integration of motion components, facilitating precise coordination and synchronization during laser processing. This ensures real-time transmission of control commands and feedback signals across multiple axes, optimizing the system's accuracy and efficiency. The motion system enables combined kinematic laser processing with fieldbus cycle times of 250 μs and galvo 2D repositioning time each 25 μs. This is achieved with own developed electronics and FIFO buffering of interpolated XY positions to achieve the desired trajectory within microseconds. This paper describes the analytical model used to achieve the combined motion as well as validation of motion and cutting velocities within the system. The experimental results show excellent process efficiency and high cut quality for several tested materials. As a conclusion, a high-speed motion system with coupled kinematics shows substantial advantages in laser materials processing thus revolutionizing manufacturing processes.