Morphology-Controllable Liquid Metal/Diamond Sandwich-Structured Thermal Interface Material toward High-Efficiency Thermal Management

. The "sandwich" packaging structure effectively mitigates the risk of LM leakage. When applied to high-power devices, the surface temperature of the heat source decreases by up to 69% compared to without TIMs. Further development of the through-plane heat transfer and in-plane waste heat conversion device allows the conversion of waste heat into a stable voltage output of 7.35 V. This marks the successful transition of TIMs from heat dissipation to energy regeneration functionality. This study presents material solution for high-power electronic thermal management and advances the practical application of LM composite materials.