材料科学
电子设备和系统的热管理
热的
形态学(生物学)
钻石
接口(物质)
散热膏
金属
纳米技术
复合材料
化学工程
工程物理
冶金
机械工程
热导率
热力学
物理
毛细管数
毛细管作用
生物
工程类
遗传学
作者
Xingye Wang,Yandong Wang,Boren Yang,Yingying Guo,Kang Xu,Zhenbang Zhang,Rongjie Yang,Jianxiang Zhang,Boda Zhu,Yue Qin,Yiwei Zhou,Linhong Li,Maohua Li,Tao Cai,Kazuhito Nishimura,Cheng‐Te Lin,Nan Jiang,Wen Dai,Jinhong Yu
出处
期刊:ACS Nano
[American Chemical Society]
日期:2025-05-29
卷期号:19 (22): 20956-20969
被引量:37
标识
DOI:10.1021/acsnano.5c03918
摘要
. The "sandwich" packaging structure effectively mitigates the risk of LM leakage. When applied to high-power devices, the surface temperature of the heat source decreases by up to 69% compared to without TIMs. Further development of the through-plane heat transfer and in-plane waste heat conversion device allows the conversion of waste heat into a stable voltage output of 7.35 V. This marks the successful transition of TIMs from heat dissipation to energy regeneration functionality. This study presents material solution for high-power electronic thermal management and advances the practical application of LM composite materials.
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