Research on Power Electronic Integrated Module for SMPs
作者
Qiaoliang Chen,Zeng Xiangjun,Yang Xu,Wang Zhaoan
出处
期刊:Journal of microelectronics and electronic packaging [IMAPS - International Microelectronics Assembly and Packaging Society] 日期:2004-10-01卷期号:1 (4): 225-230
标识
DOI:10.4071/1551-4897-1.4.225
摘要
A novel structure for a power module used in switching mode power supplies (SMPs) is presented in this paper. The power module employs the three-dimensional terrace structure resulting in lowered parasitic parameters and a higher power density. Based on this structure, the characteristics of the power module, such as parasitic parameters and thermal management performance are evaluated through simulation analysis and experimental research. The measured results for a 1kw prototype demonstrate that the power module based on an aluminum substrate has higher power density, smaller volume and better thermal performance when compared to a module using a conventional structure.