材料科学
纳米线
铜
极限抗拉强度
电子包装
电阻率和电导率
复合材料
大气温度范围
粘结强度
纳米技术
冶金
电气工程
物理
工程类
气象学
作者
Peng Peng,Anming Hu,Hong Huang,A.P. Gerlich,Boxin Zhao,Y. Zhou
摘要
Heat-sensitive components packaging requires low temperature joining technology. The present study considers the feasibility of room-temperature pressureless joining of copper wires using silver nanowire paste. These joints achieve a tensile strength of 5.7 MPa and exhibit ultralow resistivity in the range of 101 nΩ m. An “in situ cleaning” action of PVP is proposed during the bonding process.
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