铜
电阻率和电导率
材料科学
极限抗拉强度
电导率
晶界
位错
纳米尺度
复合材料
冶金
微观结构
纳米技术
化学
电气工程
工程类
物理化学
作者
Lei Lu,Y.F. Shen,Xianhua Chen,Lihua Qian,K. Lu
出处
期刊:Science
[American Association for the Advancement of Science (AAAS)]
日期:2004-03-23
卷期号:304 (5669): 422-426
被引量:2880
标识
DOI:10.1126/science.1092905
摘要
Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.
科研通智能强力驱动
Strongly Powered by AbleSci AI