Electronic Materials and Packaging

Abstract Electronic packaging is a multidisciplinary process consisting of the physical design, product development, and manufacture required to transform an electronic circuit schematic diagram into functional electronic equipment. There are four basic categories of concern to the electronic packaging engineer, working from the external environment inward: exterior conditions, internal conditions, component environments and component requirements. Several computer‐aided design programs address electronic packaging design and development tasks. Most computer algorithms are adaptations of codes generated for other, related purposes (e.g., finite‐element techniques for structures, stresses, thermal analysis, fluid flow analysis, and flow visualization; solid‐modeling and drafting programs; printed circuit board design programs). Electronic packaging applications often fall into one or more of the following categories. They are equipment attachment, equipment racks, frames, and mounting structures, equipment and module enclosures, temperature control, mechanical joints, finishes, position‐sensitive assemblies, electrical contacts, and harsh‐environment endurance.