光子学
磷化铟
光子集成电路
微电子
带宽(计算)
硅光子学
数码产品
计算机科学
集成电路
电信
工程类
电子工程
工程物理
电气工程
纳米技术
光电子学
材料科学
砷化镓
作者
M.K. Smit,Kevin Williams,J.J.G.M. van der Tol
出处
期刊:APL photonics
[AIP Publishing]
日期:2019-05-01
卷期号:4 (5): 050901-050901
被引量:195
摘要
The application market for Photonic Integrated Circuits (PICs) is rapidly growing. Photonic integration is the dominant technology in high bandwidth communications and is set to become dominant in many fields of photonics, just like microelectronics in the field of electronics. PICs offer compelling performance advances in terms of precision, bandwidth, and energy efficiency. To enable uptake in new sectors, the availability of highly standardized (generic) photonic integration platform technologies is of key importance as this separates design from technology, reducing barriers for new entrants. The major platform technologies today are Indium Phosphide (InP)-based monolithic integration and Silicon Photonics. In this perspective paper, we will describe the current status and future developments of InP-based generic integration platforms.
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