Smart manufacturing-driven probabilistic process planning for components via AP-BiLSTM-ATT

In the context of smart manufacturing, improving the quality and efficiency of process planning, especially in the processing of complex parts, has become a key factor influencing the level of intelligence in manufacturing systems. However, most current process planning methods still heavily rely on manual expertise, leading to problems such as difficulty in knowledge reuse, low planning efficiency, and slow response times, which are inadequate to meet the diverse and changing needs of engineering applications. To address these issues, this paper proposes an algorithm for Assembly Process Reasoning and Decision-making based on Bidirectional Long Short-Term Memory with Attention (AP-BiLSTM-ATT), which aims to deeply explore the hidden relationships between the multi-dimensional features of parts and process plans, thereby achieving probabilistic modeling of process decisions. Specifically, the attributes, geometric features, and historical process plans of parts are first labeled and vectorized, transforming traditional process knowledge into structured data representations suitable for deep learning models. A BiLSTM network model, integrated with a multi-head attention mechanism, is then constructed to capture contextual dependencies and semantic weight distributions between features, enhancing the model's ability to express complex process relationships. During training, the model learns the mapping distribution between features and processes from a large-scale historical process dataset, enabling intelligent reasoning and recommendation of process plans for new parts. The results show that this method outperforms traditional methods in terms of accuracy, response speed, and generalization ability in process planning, providing effective support for enhancing the intelligence of complex part process planning and laying a foundation for the structured expression and intelligent application of manufacturing process knowledge.