Integrated Fan‐Out (InFO) for High Performance Computing

3D wafer-level system integration (WLSI) is enhanced with the introduction of system on integrated chip, a disruptive front-end 3D integrated circuit. Under 3DFabric, all processes with chips embedding first before interconnection are called integrated fan-out (InFO), as the fundamental manufacturing process started with chip embedding first, followed by creating fan out interconnection. InFO, chip on wafer on substrate (CoWoS), system on wafer and system-on-integrated-substrate, form a universal WLSI technology family that will drive the industry to meet the future system scaling needs faced by increasingly more challenging and diversified computing requirements. Like in chip-last CoWoS, InFO-L uses local silicon interconnection, and InFO-R uses redistribution layer (RDL). In the future, for logic-to-logic and logic-to-memory integration, novel ultra-high-density InFO (InFO_UHD) technology with submicron RDL is being developed to provide high interconnect density and bandwidth for logic-to-logic systems.