互连
包装设计
集成电路封装
包装工程
激光线宽
嵌入式系统
材料科学
计算机科学
集成电路
工程类
系统工程
光电子学
机械工程
电信
物理
激光器
光学
标识
DOI:10.1007/978-981-19-9917-8_1
摘要
In this chapter, advanced packagingAdvanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration3D IC integration, which will be presented and discussed. ChipletChiplet design and heterogeneous integration packaging provide alternatives to the system on chips (especially for advanced nodes) will be discussed. Different substrates, such as size, pin-count, and metal linewidth and spacing for advanced packaging, are examined.
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