An Anti‐Fatigue Design Strategy for 3D Ribbon‐Shaped Flexible Electronics

Three-dimensional (3D) flexible electronics represent an emerging area of intensive attention in recent years, owing to their broad-ranging applications in wearable electronics, flexible robots, tissue/cell scaffolds, among others. The widely adopted 3D conductive mesostructures in the functional device systems would inevitably undergo repetitive out-of-plane compressions during practical operations, and thus, anti-fatigue design strategies are of great significance to improve the reliability of 3D flexible electronics. Previous studies mainly focused on the fatigue failure behavior of planar ribbon-shaped geometries, while anti-fatigue design strategies and predictive failure criteria addressing 3D ribbon-shaped mesostructures are still lacking. This work demonstrates an anti-fatigue strategy to significantly prolong the fatigue life of 3D ribbon-shaped flexible electronics by switching the metal-dominated failure to desired polymer-dominated failure. Combined in situ measurements and computational studies allow the establishment of a failure criterion capable of accurately predicting fatigue lives under out-of-plane compressions, thereby providing useful guidelines for the design of anti-fatigue mesostructures with diverse 3D geometries. Two mechanically reliable 3D devices, including a resistance-type vibration sensor and a janus sensor capable of decoupled temperature measurements, serve as two demonstrative examples to highlight potential applications in long-term health monitoring and human-like robotic perception, respectively.