The Measurement of Heat Decomposition Dynamics of the Adhesive in Adhesive-PI Joints

EDX analysis method can measure the elements contents and changes of the adhesive in adhesive-PI joints.There are different elements contents and changes between the adhesive and PI film,the weight loss of the adhesive in adhesive-PI joints can be measured with EDX,so the heat decomposition dynamics of the adhesive in the joints can be calculated.Compared with the values of heat decomposition energy of the adhesive under different conditions,it is indicated that the heat decomposition energy of the adhesive in the joints is lower than that of the adhesive in air atmosphere.This analysis method is a new method for measuring the properties of adhesive in the joints.