Cost effectiveness of silent discharge plasma for point-of-use VOC emissions control in semiconductor fabrication

Extensive research into the treatment and control of Volatile Organic Compounds (VOCs) from semiconductor industry manufacturing processes has identified the need for alternatives to existing combustion devices. Specifically, semiconductor manufacturing design is moving toward the application of effective, small-scale, abatement control technologies for specific point-of-use (POU) waste streams associated with a particular component or manufacturing tool. The consortium of companies involved in semiconductor precompetitive research and development known collectively as SEMATECH recently evaluated eleven emerging environmental technologies designed to treat POU process emissions of VOCs specific to the semiconductor industry. After rigorous technical review only one technology, the Silent Discharge Plasma (SDP) developed at Low Alamos National Laboratory, was considered to successfully meet the required technical performance standards and potential cost effectiveness necessary for continued consideration by SEMATECH in their point-of-use emissions control plans.