Development of Thermal Conductive tpPI/Oriented h‐BN Insulating Composite Material Using the Electrostatic Adsorption Method

A thermal conductive plate in a device like a power module for an automobile requires materials with high thermal conductivity, acceptable electric breakdown strength, and high thermal stability. Thermoplastic polyimide (tpPI)/oriented hexagonal boron nitride (h‐BN) composite materials are produced by an electrostatic adsorption method. The tpPI/oriented h‐BN composite shows high thermal properties (glass transition temperature of about 240 °C and a thermal conductivity of 10 W/mK or more, so on.) In addition, the direct current breakdown strength exceeds 150 kV/mm. It is cleared that the tpPI/oriented h‐BN composite exhibits an acceptable breakdown strength, high thermal conductivity, and high thermal stability. © 2020 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.