Thermal Modeling of GaN HEMT Devices With Diamond Heat-Spreader

Harvesting the potential performance of GaN-based devices in terms of the areal power density and reliability, relies on the efficiency of their thermal management. Integration of extremely high thermal conductivity Single-crystalline CVD-diamond serves as an efficient solution to their strict thermal requirements. However, the major challenge lies in the Thermal Boundary Resistance (TBR) at the interface of GaN/Diamond or SiC/Diamond. Junction temperature of the device shows a sensitivity of 1.28°C for every unit of TBR for GaN-on-Diamond compared to 0.43°C for every 10 units of TBR for GaN/SiC-on-Diamond. Finite Volume Thermal Analysis has shown a limit of around 22 m2K/GW beyond which the merit of proximity to the heat-source for GaN-on-Diamond can no more outperform GaN/SiC-on-Diamond. Besides, due to the temperature dependency of the thermal conductivity K, an increase in the temperature causes an increase in the thermal resistivity of the device which is more significant in high power operations. Simplified assumption of constant K overestimates the device performance by resulting in 17.4°C lower junction temperature for the areal power density of 10W/mm. Other part of the project regarding the in-house growth of CVD-diamond to be bonded to the GaN device has been simultaneously in progress.