Advanced Materials and Components for 5G and Beyond
计算机科学
材料科学
作者
Colin Tong
出处
期刊:Springer series in materials science日期:2022-01-01被引量:7
标识
DOI:10.1007/978-3-031-17207-6
摘要
This book gives a comprehensive guide to the current status and future trends of materials and component design for 5G and beyond wireless communications.