Experimental Investigations of Enhanced Micro Structured Heat Sinks

Abstract In this research, we focus on the performance of heat sink, new configurations of the micro heat sink with comprises of pinned copper pieces of appropriate dimensions have been proposed. Dozens of different shapes micro heat sinks have been manufactured from brass using Laser technique. These heat sinks have been coupled individually with a simulated electronic circuit including a power transistor to freely dissipate the generated heat. Bulk temperatures of heat sink and the power transistor have been measured using a thermal camera. The results showed that, in general, the finned heat sink of either configuration augments heat transfer compared with smooth one. It is found that the maximum percentage reductions in temperature of the transistor are demonstrated with two uncommon configurations, namely the leaves-shaped fin (LSF) 9.352% and the drop-shaped fin (DSF) 9.353%. on the other hand, a staggered wavy fin (SWF) shows minimum percentage reduction in transistor temperature, 0.952%. It has been shown that through this research and by using several models of heat sink, the increase in surface area is not only the factor (major) to increase the heat transfer to the surrounding environment. This makes it possible to design fins with a smaller surface area but more heat dispersionIn this research, we focus on the performance of heat sink, new configurations of the micro heat sink with comprises of pinned copper pieces of appropriate dimensions have been proposed. Dozens of different shapes micro heat sinks have been manufactured from brass using Laser technique. These heat sinks have been coupled individually with a simulated electronic circuit including a power transistor to freely dissipate the generated heat. Bulk temperatures of heat sink and the power transistor have been measured using a thermal camera. The results showed that, in general, the finned heat sink of either configuration augments heat transfer compared with smooth one. It is found that the maximum percentage reductions in temperature of the transistor are demonstrated with two uncommon configurations, namely the leaves-shaped fin (LSF) 9.352% and the drop-shaped fin (DSF) 9.353%. on the other hand, a staggered wavy fin (SWF) shows minimum percentage reduction in transistor temperature, 0.952%. It has been shown that through this research and by using several models of heat sink, the increase in surface area is not only the factor (major) to increase the heat transfer to the surrounding environment. This makes it possible to design fins with a smaller surface area but more heat dispersion.