材料科学
蚀刻(微加工)
金属浇口
光电子学
晶体管
纳米线
场效应晶体管
各向同性腐蚀
逻辑门
纳米技术
图层(电子)
栅氧化层
电气工程
工程类
电压
作者
Xiaogen Yin,Hong Yang,Lu Xie,X. Z. Ai,Y. B. Zhang,Kunpeng Jia,Zhenhua Wu,X. L.,Qingzhu Zhang,Shujuan Mao,Jinjuan Xiang,Yongkui Zhang,Jianfeng Gao,Xiaobin He,G. B. Bai,Yihong Lu,N. Zhou,Zhenzhen Kong,Yongzheng Zhang,Jianwen Zhao
标识
DOI:10.1109/led.2019.2954537
摘要
A new type of vertical nanowire (NW)/ nanosheet (NS) field-effect transistors (FETs), termed vertical sandwich gate-all-around (GAA) FETs (VSAFETs), is presented in this work. Moreover, an integration flow that is compatible with processes used in the mainstream industry is proposed for the VSAFETs. Si/SiGe epitaxy, isotropic quasi-atomic-layer etching (qALE), and gate replacement were used to fabricate pVSAFETs for the first time. Vertical GAA FETs with self-aligned high-k metal gates and a small effective-gate-length variation were obtained. Isotropic qALE, including Si-selective etching of SiGe, was developed to control the diameter/thickness of the NW/NS channels. NWs with a diameter of 10 nm and NSs with a thickness of 20 nm were successfully fabricated, and good device characteristics were obtained. Finally, the device performance was investigated and is discussed in this work.
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