毛细管作用
蒸发器
微型多孔材料
热管
包络线(雷达)
图层(电子)
电镀(地质)
热的
散热片
铜
材料科学
传热
冶金
热力学
复合材料
物理
热交换器
电信
地质学
计算机科学
雷达
地球物理学
作者
Yong Ju Lee,Y. Wang,Yoon Chang Jeong,Michael D. Atkins,Ki‐Ju Kang,T Kim
出处
期刊:Langmuir
[American Chemical Society]
日期:2024-04-08
卷期号:40 (15): 8194-8204
标识
DOI:10.1021/acs.langmuir.4c00307
摘要
Capillary-driven heat pipes are an effective thermal solution for compacting electronic cooling systems. We advance such a heat pipe thermal solution with ultralightweighting for mobile applications. In our advancement, the envelope that encapsulates the phase-change process of a working fluid is fabricated via electroless plating being ∼40 μm thick. Furthermore, the wick structure that transports condensate to a heat source via capillarity is also electroless-plated onto the envelope's inner surfaces, creating a 100-μm-thick, microporous layer. This wick structure is sequentially superhydrophilized by blackening that forms a nanotexture on the microporous wick layer. An effective density of our prototype ultralight heat pipes (uHPs), as a measure of lightweighting, indicates, on average, a remarkable 73% weight reduction of commercial counterparts with sintered copper powder wick in similar exterior dimensions (e.g., ∼2.7 g, compared to ∼10.0 g) while providing equivalent heat spreading. Furthermore, the uHP operates at a 25% lower evaporator temperature, due to additional heat rejection to the surroundings through the ultrathin-walled envelope and wick.
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