Formation and annihilation of bulk recombination-active defects induced by muon irradiation of crystalline silicon

Muons are part of natural cosmic radiation but can also be generated at spallation sources for material science and particle physics applications. Recently, pulsed muons have been used to characterize the density of free charge carriers in semiconductors and their recombination lifetime. Muon beam irradiation can also result in the formation of dilute levels of crystal defects in silicon. These crystal defects are only detected in high carrier lifetime silicon samples that are highly sensitive to defects due to their long recombination lifetimes. This work investigates the characteristics of these defects in terms of their formation, recombination activity, and deactivation. Charge carrier lifetime assessments and photoluminescence imaging have great sensitivity to measure the generated defects in high-quality silicon samples exposed to ∼4 MeV (anti)muons and their recombination activity despite the extremely low concentration. The defects reduce the effective charge carrier lifetime of both p- and n-type silicon and appear to be more detrimental to n-type silicon. Defects are created by transmission of muons through the wafer, and there are indications that slowed or implanted muons may create additional defects. In a post-exposure isochronal annealing study, we observe that annealing at temperatures of up to 450 °C does not by itself fully deactivate the defects. A recovery of charge carrier lifetime was observed when the annealing was combined with Al2O3 surface passivation, probably due to passivation of bulk defects from hydrogen from the dielectric film.