材料科学
电磁屏蔽
纳米复合材料
双层
复合材料
极限抗拉强度
韧性
电磁干扰
热导率
电磁干扰
纳米线
纳米纤维
弯曲
电阻率和电导率
薄板电阻
光电子学
导电体
柔性电子器件
电阻和电导
热阻
芳纶
电导率
热的
拉曼光谱
作者
Mengyao Wang,Xiaofeng Pan,Yuyi Wang,Qi Wang,Yì Wáng,Yanjun Ding,Bin Wu,Wenjian Zhang,Qibao Dong,Shikuo Li,Wei Bai
摘要
ABSTRACT Lightweight, high strength and toughness, outstanding thermal conductivity, and superior shielding effectiveness (SE) are critical yet challenging to achieve simultaneously in advanced electromagnetic interference (EMI) shielding materials. Herein, by integrating aramid nanofibers (ANFs) and silver nanowires (Ag NWs) into a highly dense, well‐aligned bilayer‐packed cross‐layer structure featuring an Ag NW top layer, simultaneously improved tensile strength (366 MPa), toughness (78 MJ m −3 ), electrical conductivity (11,363 S cm −1 ), in‐plane thermal conductivity (10.4 W m −1 K −1 ), and EMI SE (71 dB) are achieved. Notably, the EMI SE per unit thickness reaches 59,167 dB cm −1 . Additionally, the densified bilayer structure of the Ag NW‐ANF film endows it with remarkable resistance to bending fatigue, ensuring operational reliability in practical applications. The comprehensive performance of this nanocomposite film is superior to that of pure ANF, single‐layer Ag NW‐ANF, bilayer Ag NW‐ANF, and previously reported EMI‐shielding nanocomposites. Thus, the outstanding multifunctional performance of this nanocomposite film makes it a competitive candidate for EMI‐shielding materials in advanced electronic devices.
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