POLYMERS FOR ELECTRONIC PACKAGING IN THE 21st CENTURY

The next generation of polymeric materials for electronic packaging requires high performance, such as high T g , low loss, low dielectric constant for high frequency (in excess of 100 GHz for wireless and portable products), which are described in this chapter. Nanostructure air gap ultra-low dielectrics are developed. Furthermore, photo-definable with positive-tone materials for ease of process are needed for IG dielectric as well as sequential build-up high density PWB technology applications. High dielectric polymer composites (in excess of 100–200) with nanostructure inorganic filler will be needed for the capacitor application of building imbedded passives. Conductive polymers with high current density, high toughness, and low conductivity fatigue will be needed for ultra fine-pitch replacements for solder joint interconnects. The electronics consumer will depend on all these materials that will be multifunctional, high performance, yet low cost. It is a challenge that all chemists, materials scientists, and chemical engineers will face in the 21st century.