材料科学
复合材料
脆性
缩进
弯曲
模数
韧性
断裂韧性
弯曲模量
杨氏模量
抗弯强度
弹性模量
比模量
材料性能
抗冲击性
夹层玻璃
灵活性(工程)
抗弯刚度
断裂(地质)
断裂力学
压痕硬度
作者
Hoikwan Lee,Junyeub Lee,Sungwon Kim,Sang-Duk Lee,Yun-Young Lee,Jin-Wook Jang,Woon Jin Chung,Hoikwan Lee,Junyeub Lee,Sungwon Kim,Sang-Duk Lee,Yun-Young Lee,Jin-Wook Jang,Woon Jin Chung
摘要
Abstract Novel applications in the foldable electronics market require flexible substrates, notably ultra‐thin glass (UTG). While conventional UTG is known for its high robustness and resilience, its brittle characteristics commonly lead to cracks, breakages and other field failures. This study introduces super‐flexible and ion‐exchangeable glass for foldable displays, achieved by lowering the Young's modulus of the glass. Effective reduction of Young's modulus from 72 to 53 GPa was achieved when SiO 2 was substituted with B 2 O 3 and P 2 O 5 . Indentation and two‐point bending tests examined the bending characteristic of the glasses. The obtained low modulus glasses showed enhanced flexibility, including a high level of fracture toughness and resistance to flaw formation as well as decreased bending repulsive force, implying smaller folding radius. The enhanced flexibility of the glass, which makes it suitable for various foldable devices, was discussed based on structural changes induced by composition.
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