Throughput and Material Utilization by Glass Wafer Laser Dicing

Abstract Laser-based dicing of glass wafers for up to 300 mm diameter provides a high quality as well as a high throughput solution for dicing of glass-based products. This technology can be applied to glass wafers for Microfluidic, ME(O)MS and other semiconductor applications as for sensor cover glasses. Based on a die per wafer calculation and nominal processing speeds for laser and breaking technologies, a wafer per hour performance for small dies can be calculated. e.g. for a 3 mm square die design on a 300 mm diameter wafers, a dicing takt of ~10 wafers per hours can be expected. Exemplary investigations of a Corning® HPFS® Fused Silica (HPFS) glass wafer demonstrate the exceptional performance for chipping and edge quality and provide a quality, where the chipping performance is better than 50 μm with very precise edges and die corners.