钝化
材料科学
硅
晶体硅
光电子学
退火(玻璃)
铟
电极
开路电压
兴奋剂
分析化学(期刊)
纳米技术
化学
电压
物理化学
复合材料
电气工程
有机化学
工程类
图层(电子)
作者
Gizem Nogay,Christophe Ballif,Andrea Ingenito,Esteban Rucavado,Quentin Jeangros,Josua Stückelberger,Philippe Wyss,Monica Morales‐Masis,Franz‐Josef Haug,P. Löper
标识
DOI:10.1109/jphotov.2018.2866189
摘要
We present electron- and hole-selective passivating contacts based on wet-chemically grown interfacial SiO x and overlying in-situ doped silicon carbide (SiCx) deposited by plasma-enhanced chemical vapor deposition. After annealing at 850 °C, excellent surface passivation on the p-type planar crystalline silicon wafer is obtained for both electron- and hole-selective contacts. Their potential is demonstrated at the device level by employing a simple process flow, in which the junction formation of the two polarities is achieved with a single coannealing step. Both-side-contacted patterning-free planar p-type cells with an area of 4 cm 2 and screen-printed metallization reach a fill factor of 83.4% and a open-circuit voltage of 726 mV. Zirconium-doped indium oxide with excellent optoelectrical properties is used as a front electrode. The decrease in the parasitic absorption in the front electrode results in higher photogenerated current. By realizing front-side-textured and rear-side-planar p -type cells, an efficiency of up to 22.6% is achieved.
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