烧结
材料科学
抗剪强度(土壤)
热导率
电阻率和电导率
复合材料
冶金
分析化学(期刊)
电气工程
化学
有机化学
环境科学
工程类
土壤科学
土壤水分
作者
Dai Ishikawa,Hideo Nakako,Yuki Kawana,Chie Sugama,Motohiro Negishi,Yoshinori Ejiri,Suguru Ueda,Bao Ngoc An,Helge Wurst,Benjamin Leyrer,Thomas Blank,M. Weber
出处
期刊:2018 7th Electronic System-Integration Technology Conference (ESTC)
日期:2018-09-01
被引量:8
标识
DOI:10.1109/estc.2018.8546455
摘要
This paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures. The Cu paste can be sintered pressureless in 100% 112 or under pressure in 100% N 2 atmospheres. The as-sintered density, thermal conductivity and resistivity of pressureless-sintered Cu (in 100% 112, 300 °C, 1 h) is found to be 78%, 180 Wm -1 K -1 and 4.3 μΩ·cm, respectively. The pressureless-sintered Cu has higher 0.2% proof stress than the pressure-sintered Ag (sintered density = 87%, in air, 300 °C, 10 MPa, 10 min) as a comparison material in a three-point bending test. The die-shear strength of appropriate pressure-less-sintered Cu on four different metal adherends (Cu, Ni, Ag and Au) was 30 MPa or higher. The die-shear strength of pressure-sintered Cu in 100% N 2 was 36 MPa or higher. A thermal cycle tolerance of 1000 cycles or greater was shown in a power device test package which was bonded using the pressureless-sintered Cu and encapsulated with an epoxy molding compound. The Cu sinter paste can be used as a reliable die-bonding material for power modules operating at high temperatures.
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