Alternative 3D Double Side Molded SiP for 5G Communication

The demands for radio frequency (RF) of up-coming 5G electronic applications are gradually rising, arising recently from the need of smaller and thinner package in internet of things (IoT) and electronics devices. 3D system in package (3D SiP) including double side molding and antenna in package (AiP) could meet the above requirements. Dual side surface mounting technology (SMT) and double side molding are performed in this study to achieve miniaturization of 3D SiP module. A cost-effective and alternative molding process is completed by vacuum printing encapsulation systems (VPES) instead of common transfer molding. In this study, there are two kinds of double side molding structures, conformal and compartment molding, are employed with EMI shielding. Both molding architectures adopted conductive material as a dam to ensure electrical connectivity of side wall and sputtering metal layer to acquire EMI shielding effectiveness. To verify the reliability response of the molding structure, pre-conditioning is performed. A successful double side molding structure done by VPES with PCB warpage of 0.5 ~0.6 mm has been achieved in this work. Moreover, the dual side molding could reach the package requirements of 5G IoT module.