材料科学
复合材料
热导率
热塑性聚氨酯
石墨烯
氮化硼
复合数
微电子
界面热阻
热稳定性
热的
热阻
弹性体
纳米技术
化学工程
气象学
工程类
物理
作者
Akbar Bashir,Muhammad Maqbool,Usman Ali,Ruicong Lv,Hongyu Niu,Lei Kang,Zubair Ashraf,Shu-Lin Bai
标识
DOI:10.1016/j.compositesa.2023.107676
摘要
Miniaturization in microelectronic devices has spurred the quest for thermally conductive and electrically insulative materials. The main obstacle in using polymer composites is their poor adhesion and thermal resistance at the interface. The study proposes a novel approach: synthesizing a hybrid material consisting of chemically interconnected hexagonal boron nitride (h-BN) and reduced graphene oxide (rGO). The o-PDA-BN/rGO hybrid network structure, when used as a filler in polymer composites, exhibits significant improvement in through-plane thermal conductivity (TC) of 4.63 Wm-1K-1 and volume resistivity (1012 Ωcm) at 57 and 3 wt.% of BN and rGO filler contents respectively. Additionally, the composite demonstrates enhanced mechanical properties under tension. The experimental findings highlight the covalent interactions between o-PDA-BN/rGO hybrid fillers and thermoplastic polyurethane (TPU), leading to improved thermal stability, thermal conductivity, and mechanical properties. This research paves the way for the development of high-performance composite materials that efficiently dissipate heat in next-generation electronic devices.
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